Through silicon via





Thu, 16 Jul 2009 14:25:56 -0700

EV Group to Collaborate with Applied Materials On Thin Wafer ...

by Through silicon via  @ Thu, 16 Jul 2009 14:25:56 -0700
EV Group (EVG) today announced a joint effort with Applied Materials, Inc. to develop wafer bonding processes for the manufacture of through-silicon vias (TSVs) in three-dimensional inte...