<?xml version='1.0' encoding='utf-8' ?>
<rss version='2.0'>
<channel>
  <title>Silicon characterization</title>
  <link>http://silicon-value.com/technology/silicon-characterization/</link>
  <description>Silicon characterization, silicon conductivity, silicon density, silicon deposition</description>
<item>
<guid>http://silicon-value.com/technology/silicon-characterization/793/ulvac-rolls-pecvd-for/</guid>
  <pubDate>Thu, 16 Jul 2009 14:32:56 -0700</pubDate>
  <title>Ulvac Rolls PECVD for Tandem PV Cells - 2009-06-25 09:24:13 CDT &lt;b&gt;...&lt;/b&gt;</title>
  <link>http://silicon-value.com/technology/silicon-characterization/793/ulvac-rolls-pecvd-for/</link>
  <description>Ulvac Inc. (Chigasaki, Japan) has developed a plasma-enhanced chemical vapor &lt;b&gt;deposition&lt;/b&gt; (PECVD) system for microcrystalline &lt;b&gt;silicon&lt;/b&gt; (μc-Si) &lt;b&gt;deposition&lt;/b&gt;, aimed at tandem thin-film ...</description>
</item>

</channel>
</rss>
